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INTEGRATED CIRCUITS
DATA SHEET
TDA1016 Recording/playback and 2 W audio power amplifier
Product specification File under Integrated Circuits, IC01 August 1987
Philips Semiconductors
Product specification
Recording/playback and 2 W audio power amplifier
GENERAL DESCRIPTION
TDA1016
The TDA1016 is a monolithic integrated audio power amplifier, preamplifier and A.L.C. circuit designed for applications in radio-recorders and recorders. The wide supply voltage range makes this circuit very suitable for d.c. and a.c. apparatus. The circuit incorporates the following features: Features * Power amplifier/monitor amplifier * Preamplifier/record and playback amplifier * Automatic Level Control (A.L.C.) circuit * Voltage stabilizer * Short-circuit (up to 12 V a.c.) and thermal protection. QUICK REFERENCE DATA Supply voltage range Supply current; total quiescent at VP = 6 V Operating ambient temperature range Power amplifier Output power at dtot = 10% VP = 6 V; RL = 4 VP = 9 V; RL = 4 Closed loop gain Preamplifier Open loop gain Minimum closed loop voltage gain Output voltage at dtot = 1% Automatic Level Control (A.L.C.) Gain variation for Vi = 40 dB Stabilized supply voltage Output voltage V5-16 typ. 2,6 V Gv typ. 2 dB Go Gc min Vo min. min. min. 70 dB 35 dB 1V Po Po Gc typ. typ. typ. 1W 2W 36 dB VP Itot Tamb typ. 3,6 to 15 V 10 mA -25 to 150 C
PACKAGE OUTLINE 16-lead DIL; plastic, with internal heat spreader (SOT38); SOT38-1; 1996 July 23.
August 1987
2
Philips Semiconductors
Product specification
Recording/playback and 2 W audio power amplifier
TDA1016
Fig.1 Block diagram with external components; also used as test circuit.
August 1987
3
Philips Semiconductors
Product specification
Recording/playback and 2 W audio power amplifier
RATINGS Limiting values in accordance with the Absolute Maximum System (IEC 134) Supply voltage (pin 3) Repetitive peak output current Non-repetitive peak output current (pin 1) Total power dissipation A.C. short-circuit duration of load during sinewave drive; VP = 12 V Crystal temperature Storage temperature range Operating ambient temperature range THERMAL RESISTANCE The power derating curve (Fig.2) is based on the following data From junction to ambient Rth j-a = tsc Tc Tstg Tamb max. max. VP IORM IOSM max. max. max.
TDA1016
18 V 1A 2A
see derating curve Fig.2 100 hours 150 C -55 to + 150 C -25 to + 150 C
55 K/W
Fig.2 Power derating curve.
August 1987
4
Philips Semiconductors
Product specification
Recording/playback and 2 W audio power amplifier
CHARACTERISTICS VP = 6 V; RL = 4 ; f = 1 kHz; Tamb = 25 C; measured in test circuit Fig.1; unless otherwise specified SYMBOL Supply (pin 3) VP Itot Power amplifier Output power at dtot = 10%; see note 1 Po Po Gc dtot |Zi| RR Vn(rms) Vn Preamplifier Go Gc Gc min Vo Vo dtot dtot S/N |Zi| RR |Zo| Open loop voltage gain at f = 10 kHz Closed loop voltage gain Minimum closed loop voltage gain (when changing Rf) Output voltage at dtot = 1% Output voltage with A.L.C. Vi = 2 mV Total harmonic distortion with A.L.C. Vi = 2 mV Vi = 360 mV Signal-to-noise ratio related to Vi = 1,2 mV; RS = 1 k; B = 60 Hz to 15 kHz Input impedance Ripple rejection at f = 100 Hz; RS = 0 Output impedance; see note 2 50 - 54 - - 50 - 100 60 - - - - - - - 1 3 0,45 0,5 0,55 35 1 - - - - 70 - 78 52 - - VP = 6 V VP = 9 V Closed loop voltage gain Total harmonic distortion at Po = 0,5 W Input impedance Ripple rejection at f = 100 Hz (RS = 0 ) Noise output voltage (r.m.s. value) RS = 0 ; B = 60 Hz to 15 kHz Noise output voltage at 500 kHz RS = 0 ; B = 5 kHz - 8 - - 90 200 - - - - 0,5 40 1 2 36 - - 50 - - - 1 - - Supply voltage Supply current; total quiescent at VP = 6 V - 10 - 3,6 6 15 PARAMETER MIN. TYP.
TDA1016
MAX.
UNIT
V mA
W W dB % M dB V V
dB dB dB V V % % dB k dB
August 1987
5
Philips Semiconductors
Product specification
Recording/playback and 2 W audio power amplifier
SYMBOL Gv tl ts tr Voltage stabilizer V11-15 l11 RR Notes 1. Measured with an ideal coupling capacitor connected to the speaker load. 2. lP (effective value) must not exceed 1 mA. 3. At Vi = dB with respect to Vi = 1,2 mV. Output voltage Load current Ripple rejection at f = 100 Hz - - 40 2,6 - - - PARAMETER Gain variation for Vi = 45 dB Limiting time; see note 3 Level setting time; see note 3 Recovery time; see notes 3 and 5 MIN. - - - - TYP.
TDA1016
MAX.
UNIT
Automatic Level Control (A.L.C.) (see Fig.3); see note 4 2 - - 100 3 50 50 - dB ms ms s
V mA dB
1,5 -
4. The A.L.C. tracking in stereo has a typical spread of 1 dB if pins 6 of both ICs are connected to the same RC network. 5. Without a shunt resistor across A.L.C. With 1 M or 2,2 M across A.L.C. recovery time becomes 22 or 50 seconds.
August 1987
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Philips Semiconductors
Product specification
Recording/playback and 2 W audio power amplifier
TDA1016
Fig.3 Typical A.L.C. curve with RS = 10 k.
August 1987
7
Philips Semiconductors
Product specification
Recording/playback and 2 W audio power amplifier
PACKAGE OUTLINE DIP16: plastic dual in-line package; 16 leads (300 mil); long body
TDA1016
SOT38-1
D seating plane
ME
A2
A
L
A1
c Z e b1 b 16 9 MH wM (e 1)
pin 1 index E
1
8
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT38-1 REFERENCES IEC 050G09 JEDEC MO-001AE EIAJ EUROPEAN PROJECTION A max. 4.7 0.19 A1 min. 0.51 0.020 A2 max. 3.7 0.15 b 1.40 1.14 0.055 0.045 b1 0.53 0.38 0.021 0.015 c 0.32 0.23 0.013 0.009 D (1) 21.8 21.4 0.86 0.84 E (1) 6.48 6.20 0.26 0.24 e 2.54 0.10 e1 7.62 0.30 L 3.9 3.4 0.15 0.13 ME 8.25 7.80 0.32 0.31 MH 9.5 8.3 0.37 0.33 w 0.254 0.01 Z (1) max. 2.2 0.087
ISSUE DATE 92-10-02 95-01-19
August 1987
8
Philips Semiconductors
Product specification
Recording/playback and 2 W audio power amplifier
SOLDERING Introduction
TDA1016
There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code 9398 652 90011). Soldering by dipping or by wave The maximum permissible temperature of the solder is 260 C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Repairing soldered joints Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds. DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
August 1987
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